We have is a versatile laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is often used in R&D environments, as well as production of smaller substrates as e.g. ceramic PCBs.

FEATURES

• Fixed optic or scanner setup
• Single or dual process heads
• Process gas (N2,O2,Ar,...)
• Processing one or more substrates in parallel
• Automatic camera calibration
• Automated routines for reference runs
• Automated process control
• Automated vision system for precision alignment and scaling, offset, trapezoidal and rotation compensation.
• Stand alone and production line integrated systems

Some Technical Feature:

• Accuracy  :      < +/- 10 µm abs.
                         < +/- 2 µm repeatability
• Substrate
      Dimensions              up to 610 x 410 mm
      Thickness                 > 50 µm
       Material                    PCB, Ceramic, Silicon, Steel
• Available laser             Wave length: 9.4, 10.6 µm (CO2)
  sources                          1064, 1030, 532, 515, 355 nm
                                         Pulse: µs, ns, ps, fs
• Laser spot size             10 - 300 µm
• Dimensions                   1900 x 2800 x 1900 mm
• Weight                           3500 - 4200 kg
• Power supply                 200 - 480 V
• Compressed dry air       6 - 7 bar